Product Range
Grind-Lap -Polishing Pads cover the need of various types of materials to be polished. These pads are suitable for various rough and final polish operations to meet desired surface finish requirements. The pads impart desired surface finish when used in combination with suitable polishing media. Its napped structure helps to retain the polishing Media for a long time and facilitates to produce desired surface finishes. All pads are available with suitable adhesive backing with user friendly fixing and removal.
Applications : Silicon Wafer, Glass, Plastic, Ceramics, GaAs, Quartz, Metal Parts etc.
Sizes: Dia 305 to Dia 1400mm
ask for