GrindlapIndia Dicing Machine

Product Range

Lapping Machine >> Dicing Machine

PC Base system and GUI(Grapic User Interface)

Easy operation

User friendliness

High precision

Auto Alignment system

Silicon Wafer, GaAs Wafer, SAW Filter, LiNbO3, LiTaO3, Sapphire, LD, LED,IC Chip, NTC Sensor, Optic. parts

Model		Unit	ADS-150	ADS-200	PDS-250
Max. workpiece size		mm	Ø152.4	Ø200	Ø250
X-axis	Useable stroke	mm	160	210	260
X-axis	Cut speed	mm/sec	0.1~400	0.1~400	0.1~400
Y-axis	Useable stroke	mm	160	210	250
	Resolution	mm	0.0002	0.0001	0.0002
	Indexing accuracy	mm	0.002	0.002	0.002
	（Single pitch)	mm	0.002	0.002	0.002
	Indexing accuracy	mm	0.005/160	0.005/210	0.005/250
	（Cumulative pitch)	mm	0.005/160	0.005/210	0.005/250
	Indexing step	mm	0.0002	0.0001	0.0002
Z-axis	Useable stroke	mm	50	40	50
	(For 2" Blade)	mm	50	40	50
	Resolution	mm	0.0005	0.0001	0.0005
	Repeating accuracy	mm	0.001	0.001	0.001
	Blade size	mm	52 or 76.2	52 or 76.2	52 or 76.2
θ-axis	Rotation angle	Deg.	100 or 380(Option)	100 or 380(Option)	100 or 380(Option)
Spindle	Power	kW	1.5	2.2	2.2
Spindle	RPM	rpm	50,000	50,000	50,000
Vision unit			Manual alignment system	Manual or Auto(Option) alignment system	Auto alignment system
Dimension(WDH)		mm	72010001500	7509751600	115011601280
Weight		Kg	900	950	1000

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