Lapping Machine >>
Double Side Process
Lapping Machine
Features
- Independently driven machine ( 4 motor )
- Provides various option & method during lapping process
- Provides various options during the plate adjusting
- German made transmission applied
- Provides Anti-Vibration, High-Durability, Reasonable Price
DMP Machine
Features
- Anti-Vibration design
- Provides stable run for thin, fragile applications
- Hydro-Static facing unit applied
- Time saving by Self Re-conditioning (Facing Upper and Lower)
- High-Quality pressure resolution, actual Pressure display applied
- Provides optimized program
DMP Machine
Features
- Anti-Vibration design
- Provides High-Stability for thin products
- Optimized frame for Double Side CMP
- Optimized program for Double Side CMP
- Plate cooling system applied
- Optimized Pressure-Control system applied
Specifications
Model No. |
ADL-2206L(22B6L) |
Carrier |
22B |
Expected Q'ty Control |
1~2um TTV |
Application |
Applicable wafer size |
4"~8" |
Applicable wafer thickness |
T0.5mm |
Utility |
Electricity |
380V 3P 60Hz |
Air supply |
0.5~0.6Mpa |
Dimension(WxDxH) |
2720 x 1500 x 2493 |
Weight (Lapping plate included) |
10500kg |
Floor Space |
3.5 x 2.5M |
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