grindlapindia.com

Product Range

  • Lapping Machine

Lapping Machine

 
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Features

 
  • Independently driven machine ( 4 motor )
  • Provides various option & method during lapping process
  • Provides various options during the plate adjusting
  • German made transmission applied
  • Provides Anti-Vibration, High-Durability, Reasonable Price

DMP Machine

 
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Features

 
  • Anti-Vibration design
  • Provides stable run for thin, fragile applications
  • Hydro-Static facing unit applied
  • Time saving by Self Re-conditioning (Facing Upper and Lower)
  • High-Quality pressure resolution, actual Pressure display applied
  • Provides optimized program

DMP Machine

 
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Features

 
  • Anti-Vibration design
  • Provides High-Stability for thin products
  • Optimized frame for Double Side CMP
  • Optimized program for Double Side CMP
  • Plate cooling system applied
  • Optimized Pressure-Control system applied
 

Specifications

 
Model No. ADL-2206L(22B6L)
Carrier 22B
Expected Q'ty Control 1~2um TTV
Application Applicable wafer size 4"~8"
Applicable wafer thickness T0.5mm
Utility Electricity 380V 3P 60Hz
Air supply 0.5~0.6Mpa
Dimension(WxDxH) 2720 x 1500 x 2493
Weight (Lapping plate included) 10500kg
Floor Space 3.5 x 2.5M
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